The Linley Group’s 3rd edition of "A Guide to High-Speed Embedded Processors" has been extensively revised to cover new products and trends in this important market. Particular attention is paid to the shift from standalone to integrated processors and the shift from single-CPU to multicore. New in this edition is the inclusion of market size and market share by vendor, instruction set, and application. EEMBC scores are included where available.

The report provides extensive coverage of high-end embedded processors with over 180 pages of information on products from AMCC, Broadcom, Cavium, Freescale, IBM, Intel, PMC-Sierra, and Raza. Other vendors covered include AMD, PA Semi, SafeNet, Toshiba, Via Technologies, and more.

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For more information, or to place your order, contact:
Candace Doyle: email or telephone 1.408.370.7631

Designing SOCs with Configured Cores: Unleashing the Tensilica Xtensa and Diamond Cores by Tensilica’s Steve Leibson is an essential reference for system-on-chip designers that uses EEMBC benchmarks to compare Tensilica cores with competitive devices. Order your copy today at Amazon.